| 释义 |
封装
基本例句
encapsulationcapsulationpackagingposttingencapsulatepottingenclosure
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays. |