| 释义 |
bonding pad
基本例句
焊盘,连接区,结合片,结合区
A second contact pad has a plurality of contacts connected to the other side of the fuse line.第二接触焊盘具有连接到保险丝线的另一侧的多个接点。
To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.为了获得要求的凸起高度，锡膏在晶片焊盘过焊。 |