| 释义 |
wafer chuck短语¹⁴⁴⁹⁷²⁺²
基本例句
硅片夹
A temporary boundary condition is built to calculate the relative non-flatness of wafer chuck line by line and eliminate the effect of the wafer surface shape with recursion formula.
通过建立临时边界条件，以递推法消除晶圆面形影响，并逐行计算出承片台的相对不平度； cnoptics
A novel in-situ non-flatness measurement method of wafer chuck in step-and- scan projection lithographic tool is presented.
提出一种步进扫描投影光刻机承片台不平度检测新技术。 dictall
The local heights of wafer surface are measured by the linear variable differential transformer LVDTs when the different offsets between wafer and wafer chuck exist.
在晶圆与承片台存在不同偏移量时，利用线性差分传感器在线测量晶圆上不同点的局部高度； cnoptics |