释义 |
Wafer bumping 基本例句 凸点制作 Wafer bumpingby electroless nickel and stencil printing化学镀镍、模版印刷法制备倒扣芯片焊料凸点 Wafer bumpingfacing the challenge of Pb-free solder and fine pitch面对无铅焊料和微细间距挑战的晶圆凸点 How to Use the Thermal Saturation Method to Solve the Reflow Issue in Wafer Bumping Process如何以热饱和效应克服晶圆凸块回焊制程的问题 |