| 释义 |
Wafer bumping
基本例句
凸点制作
Wafer bumpingby electroless nickel and stencil printing化学镀镍、模版印刷法制备倒扣芯片焊料凸点
Wafer bumpingfacing the challenge of Pb-free solder and fine pitch面对无铅焊料和微细间距挑战的晶圆凸点
How to Use the Thermal Saturation Method to Solve the Reflow Issue in Wafer Bumping Process如何以热饱和效应克服晶圆凸块回焊制程的问题 |