| 释义 |
bga 英b'ɡɑː美b'ɡɑː COCA²¹²⁸¹³BNC¹²⁶⁴¹⁶⁺⁴
基本例句
ball grid array,球状矩阵排列
And the important role of advanced packagings such as CSP, BGA and Flip- chip technology in the microelectronics is described as well.
论述了如 CSP、 BGA及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。 cnki
The fact that BGA could influence the effect of FA HDL was attributed to the properties of BGA and the photosynthetic characteristics of E.
BGA对 FA旱地龙作用效果的影响原因可能与 BGA和植物本身的光合特性有关。 cnki
The term chip scale packageCSP has become synonymous with“ fine pitch BGA” as the distinction between a ball grid array BGA and some chip scale packages become nearly indistinguishable.
芯片规模封装与球栅阵列 BGA封装之间的区别变得不可分辨，已成为“细间距 BGA”的同义词。 cnki
The emergence of BGA technology has forced manufacturers to take a new look at their assembly processes.
BGA技术的出现给制造业带来了压力，迫使人们要用一种新的眼光来寻找装配工艺方法。 cnki
The BGA program can be described as a time-contingent increase in activities from baseline toward predetermined goals.
BGA计划可被描述为按时间将活动时间从基线提高到预定目标。 oaopdoc
Achieving good soldering quality of BGA is a task in the face of all SMT technicians.
实现 BGA的良好焊接是摆在所有 SMT工程技术人员面前的一个课题。 cnki
AMD Wichita, which will utilize FT2 BGA packaging, will be the heart of Deccan platform for networks, low- cost ultra-thin notebooks and net tops.
AMD威奇托，将利用FT2 BGA封装，将德干高原平台的上网本，成本低廉的超薄笔记本电脑和上网机的心脏。 pczilla
Ball grid array BGA packaging is widely used in surface mount assembly for its good performance.
球栅阵列封装 BGA综合性能好，广泛应用于表面贴装。 dictall
Finally, we recommended an approximate coupling range of soil moisture and BGA dosage, which was suitable to cold resistance of E. japonicus.
最后，提出了适宜于大叶黄杨抗寒性的土壤水分、 BGA用量的大致耦合范围。 cnki
Hands tin stove, electric cutting machine, BGA reworking station, assembly equipment.
手浸锡炉，电动切脚机， BGA返修站和元件成型设备一批。 a13240598381.blog.bokee.net
Immunohistochemical and FCM methods were used to research on the relation-ship of BGA expression and DNA content to pathological morphology in esophageal carcinoma.
应用免疫组化及 FCM方法研究食管鳞癌血型抗原表达和 DNA含量并分析与病理形态学的关系。 cnki
In this paper, we analyzed the traditio-nary hot air soldering technology of BGA rework equipments, and described the development of control principle and control form for infrared heating.
本文详细介绍了在 BGA返修设备中由传统的热风焊接方式，发展到红外加热控制形式及其控制原理。 cnki
In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在大规模集成芯片中以 BGA球栅阵列封装的 IC芯片被广泛使用。 cnki
It is ideal for cleaning thru hole, BGA and SMT designs, and rinsing residues from connectors.
它是清洁孔洞， BGA和 SMT设计的理想清洁剂，还可以清洗连接器的残留物。 www.e-gtm.com.cn
Linear small deformation and nonlinear large deformation simulation had been carried out on stacked die BGA SDBGA matrix.
对层叠芯片 BGA SDBGA阵列进行了线性小变形和非线性大翘曲仿真。 cnki
Overall design of soldering and SMD/ BGA desoldering function.
全面性维修设计，包括焊接及 SMD/ BGA拆焊双功能。 iciba
Recently, designers developed a new type of package: ball grid array BGA package.
近几年出现了一种全新的封装形式：球栅阵列封装 BGA。 cnki
SMT maintain, BGA chip rework, the good solderability, the low smog.
SMT维修、 BGA芯片焊接与植球，活性强，低烟雾。 www.ccbai.com.cn
So, the changes of BGA expression and DNA content can reflect the degree of malignancy in esophageal carcinoma.
因此，血型抗原表达的变化， DNA含量的改变可以反映食管癌的恶性程度。 cnki
Spur gear SGA or compound bevel gear BGA attachments can be provided in any position shown in Figure1.
如果采用正齿轮 SGA或复合伞齿轮 BGA附件，则可以在图1中显示的各个位置安装手轮。 h6688
Taking as example for PBGA and CBGA, two different package structures of BGA and the attentions during generalstencil design and ass.
以常用的 PBGA和 CBGA为例，分析了两种不同封装形式 BGA通用网板的设计和组装过程中应注意的问题。 dictall
Unique built-in sucker is used to lift up and place the component to meet BGA non- touch nature.
独有内置吸盘，可提起及重置组件，符合 BGA免触的特性。 sunkko.com
BGA problem is the appearance after reflow inspection.
BGA的问题是回流焊后的外观检查。 enpudn.com |