| 释义 |
solder joint短语¹⁸⁰⁰⁹⁸⁺¹
基本例句
焊接接缝,钎焊接头,钎焊缝
Furthermore, the formation of cracks results in the degradation of solder joint strength, but affects mildly to the electrical properties.
裂纹的产生导致了两种焊点强度的降低，对其电性能的影响却甚微。 cnki
The board defect of the circuit measuring includes two parts: The solder joint defect measuring and measuring of the components and parts.
电路板缺陷检测包括两部分：焊点缺陷检测和元器件检测。 fabiao
The evolving parameters of SMT solder joint is directly related with the reliability of the solder joint.
焊点形态参数直接影响 SMT焊点的可靠性。 chemyq
The experiment results show that there is linear relationship between the solder joint creep damage and its resistance changes.
研究表明，焊点的蠕变损伤与其电阻变化存在着线性关系。 rjggy.net
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array PBGA component.
基于正交试验设计法对塑封球栅阵列 PBGA器件焊点工艺参数与可靠性关系进行了研究。 dictall
The quality of solder joint affects the reliability of the products produced by SMT directly.
由表面组装技术 SMT形成的产品，其焊点质量直接影响到产品的可靠性。 cnki
The quality of solder joint is related to its shape in products produced by SMT.
由表面贴装技术 SMT形成的产品，其焊点质量与焊点的形态有关。 cnki
The shape of solder joint is related to the quality of a SMT product. Solder Joint quality can be controlled through predicting and controlling of the solder joint shape.
表面组装技术 SMT产品焊点质量与焊点形态有关，通过对焊点形态的预测和控制，可以达到控制焊点质量的目的。 cnki
Based on the procedure for parametrical optimization of MEWMA control chart, a case study of its application in surface mount process for the solder joint quality control was presented.
提出了 MEWMA控制图参数优化方法，对电子产品装配中的表面贴片工艺过程的焊点质量控制进行了研究。 cnki
Check the appearance and shape of the solder joint, contact angle and the others should be in line with technological requirements.
主要检查焊点外观成形、润湿角等应符合工艺要求； www.1x1y.com.cn
During the course of SMT production, if the quality of solder joint can be evaluated and controlled in real-time, the productivity of SMT and the reliability of products can be improved accordingly.
在 SMT产品生产过程中，如果能够对焊点质量进行实时评价和控制，将能提高生产率和产品的可靠性。 cnki
In order to overcome the error alarming and unintelligence of the automatic optical inspectionAOI system for the solder joint inspection, a new inspecting method based on neural network is proposed.
针对目前自动光学检测系统在进行焊点检测时容易出现缺陷误报和漏报，以及智能化程度不高的问题，提出了一种基于神经网络的检测方法。 dictall
In the modern automotive industry, extensive use of spot-welding in the body, the solder joint failure is the main reason leading to vehicle failure.
在现代汽车工业中，点焊广泛运用在车身中，焊点失效是导致车身失效的主要原因。 dictall
On the basis of this theory, SMT solder joint quality fuzzy diagnosis technology was studied.
以该理论为支持 ，提出了 SMT焊点质量模糊诊断技术。 cnki
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述； cnki
Secondly, the radiance model of the illuminator and the irradiance model of the solder joint are developed.
然后，建立了光源的照度模型以及焊点的反射模型。 eope
So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.
因此，焊点跌落可靠性是无铅便携式电子产品可靠性的关键内容。 fabiao
The ANN-based expert- system applied to SMT solder joint quality control is presented, that is very important to evaluate and control the quality of solder joint in real-time and accurately.
提出了基于神经网络的 SMT焊点质量专家控制系统，其对于实现SMT焊点质量实时、准确地评价和控制有着重要的意义。 cnki
The prediction of fatigue life, especially high- cycling fatigue life, of a solder joint is one of the most difficult problems in electronic industry.
最后，提出了简便预测这类结构的高周疲劳寿命方法，且预测结果与试验结果吻合较好。 dictall
The results are of importance to design and optimize of geometry shape of the solder joint.
这一结果对于焊点几何形态的设计及优化具有指导意义。 cnki
This work does the process of lead-free reflow soldering under N2 protection, and the solder joint quality has been analyzed statistically.
通过新制定的氮气保护无铅再流焊工艺，对焊点外观质量进行了统计分析。 chemyq
With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability.
由于封装材料与封装工艺的改变，给焊点可靠性带来了一系列相关问题。 dictall |