| 释义 |
SnAgCu
基本例句
锡银铜¹⁰⁰
There is no industry control limits for Copper and Lead inSnAgCusolder pot.目前行业中没有用于SnAgCu焊料槽中铜和铅的控制极限。
A study in the reactions betweenSnAgCulead-free solders and Au/Ni surface finish in BGA packages.萧丽娟;化学工程与材料工程研究所;国立中央大学;硕士;2002-07-18
free-lead solder powder ofSnAgCusystemSnAgCu系无铅焊锡粉末
Wetting Property of Surface Mount Componest forSnAgCuSolder AlloysSnAgCu系钎料合金对表面贴装元件润湿特性研究
Research on theSnAgCuLead Free Solder with Minute Amount Rare Earth Elements添加微量稀土元素的SnAgCu无铅钎料的研究
Wettability ofSnAgCuLead-free Solder Containing Low Ag for Different Substrate with Water-soluble Flux水洗钎剂下SnAgCu系钎料对不同基板的润湿特性 |