| 释义 |
silicon wafer短语⁹⁰⁸⁸⁷⁺⁷
基本例句
硅片
Test of the system on a flat mirror and a silicon wafer demonstrates its usefulness. The accuracy and stability of the measurement is discussed.
此系统经以平面镜及晶圆进行实测，以验证及探讨此量测系统之准确性、误差与稳定性。 airiti.com
The Suntech researchers developed a way to chemically treat the silicon wafer in narrow bands.These treated areas attract silver, which forms metal lines just20 micrometers wide.
尚德的研究人员研发了一种化学方法，在窄带中处理硅片，该区域能吸收银，形成宽约20微米的金属线。 yeeyan
A model was proposed on the elastic deformation of silicon wafer contact in bonding.
提出了键合过程中硅片接触的一种弹性形变模型。 dictall
ABS is spin- coated on the surface of the silicon wafer. A series of processes are used to enhance the adhesion of the films.
ABS胶以旋涂的方法涂布在硅片表面，然后经过一系列的处理工序以增强膜与衬底的粘附性。 cnki
Based on this, the overall structure of the test apparatus for silicon wafer grinding is designed.
在此基础上，设计了硅片磨削试验台的整体结构； cnki
Besides, the film on the surface of glass has been successfully transferred to another silicon wafer.
此外，我们还将产生的玻璃表面的薄膜成功的转移到另一块硅基底上。 cnki
But in view of the limited reduction space upon cost of solar cell of silicon wafer, it is hard to compete with conventional energy.
但是，基于硅片的太阳电池成本下降的空间有限，很难与常规能源相竞争。 cnki
In experiment, a series of silicon nitride thin films are prepared on cleaned silicon wafer by varying deposition parameters.
本实验通过系统地改变沉积参数，在经过清洗好的单晶硅片上沉积了一系列的氮化硅薄膜。 cnki
Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.
制造集成电路需要将如半导体和金属等多层材料放置在硅片上。 yeeyan
This accelerometer is fabricated by N type silicon wafer. To obtain high aspect ratio structure, deep reactive ion etching DRIE process is employed.
加速度计用普通的 N型硅片制造，为了刻蚀高深宽比的结构，使用了深反应离子刻蚀 DRIE工艺。 cnki
This equipment is applied to stripping silicon wafer through heating water to certain temperature…
本设备是将水加热到一定温度，用于硅片脱胶的一款设备… qd-chaoshengbo.com
This pneumatic servo load system can satisfy the needs of double-sided polishing machine, which can successfully produce the ultra- smooth and flat surface on both sides of silicon wafer.
结果表明气动伺服加载系统能满足双面抛光的要求，可以加工出双面超平滑的硅片。 cnki
Using silicon wafer as substrate makes compatibility with IC technology possible.
使用硅片作为衬底使得与 IC工艺的兼容成为可能。 fabiao |