| 释义 |
plating solution短语¹⁸⁰⁰⁹⁸⁺¹
基本例句
电镀液
Coat the surface with either nickel or copper nickel is now generally the preferred commercial process from an electroless plating solution.
用镍或者铜在无镀电镀液中进行表面处理，目前镍是更流行的商业用工艺。 biodic
Emphases are made on the selection of surfactant and the relationship between fluorinated carbon particle content in plating solution and that in coatings.
包括优良表面活性剂的选择，镀液中氟化石墨微粒含量与镀层中微粒含量的关系以及操作条件的影响。 cnki
The change of the current density of the upper and lower specification limits by plating solution is the nature of concentration, temperature and stirring, factors such as the decision.
电流密度的变化的上限和下限是由电镀液的本性﹐浓度﹐温度和搅拌等因素决定的。 hfsdm
The weight of copper plating solution in a unit volume was function of contents of cupric pyrophosphate and potassium pyrophosphate.
镀液单位体积的重量是焦磷酸钾和焦磷酸铜含量的函数。 dictall
Cathodic polarization curve and cyclic voltammetric curve of sulfate copper plating solution are determined with1286 electrochemical interface and rotating disc electrode.
采用1286电化学接口及旋转圆盘电极测定了硫酸铜镀液阴极极化曲线和循环伏安曲线。 cnki
Electroplating industry circulation- filtering various plating solution.
电镀业循环过滤各类电镀液。 china-pump
In some cases, if the salt solution of the metal ion content for simple ion, the coating, therefore, coarse grains to adopt complexation ion of plating solution.
有些情况下﹐若镀液中主盐的金属离子为简单离子时﹐则镀层晶粒粗大﹐因此﹐要采用络合离子的镀液。 hfsdm
Satisfactory effect was achieved when using diagnosis chart and component index to diagnose whether component is sufficient or lack in plating solution for best result in production.
运用诊断图表和指数法在生产中判断镀液成分的丰缺，获得了满意的效果。 dictall
Sodium sulfate and sodium phosphite are tending to be accumulated gradually in the solution during electroless nickel plating, which affect the life of the plating solution.
随着施镀的进行，化学镀镍液中的硫酸钠和亚磷酸钠的积累越来越多，从而影响镀液的使用寿命。 dictall
The factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated.
结果表明，优选出的的镀液稳定性相对较高、沉铜速度快、镀层外观较好。 dictall
The plating solution has high cloud point and wide range of operating temperatures, to be able to keep a continuous production without raising or lowering temperatures.
该工艺镀液浊点高、工作温度范围宽，不需加温和降温便可保持连续生产； cnki
This paper introduces the reason, time and method of bright CuSO4 plating solution's dealing with active carbon, and indicates several issues which should be attentive.
本文简要介绍了光亮酸性硫酸铜电镀液进行活性炭处理的理由、时机和方法，并指出了应注意的几个问题。 chemyq
Using molecular sieve type plating solution additive is very favorable to raising coat thickness, coat adhesion and its stability.
使用分子筛型镀液添加剂对提高镀层厚度、镀层结合力及其稳定性都非常有利。 cnki
Plating solution of quantitative supplies.
电镀液的定量补给。 china-pump |