| 释义 |
planarization 英plænəraɪ'zeɪʃn美plænəraɪ'zeɪʃn COCA²⁰¹⁸²⁷
基本例句
n.平面化¹⁰⁰
And the slopes of characteristic line sections represent planarization of film surface.
特征线段的斜率反映了薄膜表面的平面度。 cnki
At present, chemical- mechanical polishingCMP has become a widely accepted global planarization technology.
化学机械抛光技术是迄今几乎唯一的全局平面化技术。 cnki
Slurry used for wafer planarization splatters and sticks on the surface of CMP retaining rings.
CMP制程使用的研磨液会飞溅和粘附在 CMP环的表面上。 scm-peek
The conditioning ring polishing machining is used for ultra- precision planarization; and kinematical analysis on pitch polishing is carried out.
修正环型抛光机用于超精密平面抛光，并对沥青抛光进行了运动学分析。 dictall
The copper chemical mechanical polishing CMP which is the key planarization technology for ULSI manufacturing was discussed, and the progress and problems of CMP were reviewed in the paper.
对 ULSI制备中铜布线化学机械抛光 CMP进行了分析，综述了铜 CMP技术的研究现状。 cnki
The use of different barrier slurries for copper chemical mechanical planarization CMP creates a challenge for post-CMP cleaning.
铜化学机械平面化不同阻挡层浆料的应用引起了铜CMP后清洗的问题。 cnki
The planarization characteristics of polyimide, spin on glass and benzocyclobutene BCB are presented, and the process theory of planarization using non- photosensitive benzocyclobutene is described.
分别介绍了聚酰亚胺、旋涂玻璃膜和苯并环丁烯 BCB的平坦化特性，论述了非光敏 BCB树脂的平坦化工艺原理。 cnki
Using the polishing pad with grooves or rougher surfaces can increase the material removal and planarization rate.
抛光垫粗糙的表面有利于提高材料去除率。 cnki
As a unique global planarization method, chemical mechanical polishing CMP, which has been developed at a fast pace, finds wide applications in ULSI's in recent years.
作为唯一能实现全局平坦化方法的化学机械抛光 CMP，近年来发展迅速，应用广泛。 cnki
At the present time, chemical mechanical planarization CMP is the most effective technology for global and local planarization of the wafer in IC manufacturing.
目前，化学机械抛光技术 CMP被认为是能够实现晶圆表面局部平坦化和全局平坦化的最佳方法。 cnki
Authors tried to develop a novel planarization process using polishing techniques before the continuous process at the PCB fabrication.
作者尝试去开发一种新型的整平化技术过程中，在接下来的 PCB制造前使用了抛光工艺。 ce.sysu.edu.cn
Chemical mechanical planarization CMP has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafer topography.
化学机械抛光 CMP在半导体工业内获得了广泛的赞同，对控制形貌起伏的硅片表面当作首选方法。 cnki
However, the traditional CMP technology has some disadvantages and limitations. It is important to research and develop new planarization technology while improving the traditional CMP technology.
然而，传统 CMP技术还存在一定的缺点或局限性，人们在不断完善 CMP技术的同时，也在不断探索和研究新的平坦化技术。 cnki
In the first step, high complex, low oxidation, small abrasive and high concentration model yield low scathe, high CMP rate, high selectivity, high planarization and high clean;
初抛采用“高络合、低氧化、小粒径、高浓度”的机理模型，达到低损伤、高速率、高选择、高平整、高洁净； cnki
Manet's“ Luncheon on the Grass” in the magical realism at the same time containing the decorative effect. C planarization.
马奈的《草地上的午餐》在写实的同时含有奇妙的装饰效果。三平面化。 cutpic
This paper introduces that we can reduce Within wafer nonuniformityWIWNU to achieve part and full planarization by distributing the speed of polishing head and polis.
介绍了在化学机械抛光过程中，可以通过抛光头与抛光台运动速度关系优化配置，降低晶片表面不均匀度，从而更好地实现晶片局部和全局平坦化。 dictall |