| 释义 |
Lead/lead frame
基本例句
键合指
Any chamber size are available for customer'sLeadframe or strip.可以制作特殊规格的工作室尺寸。
C194 copper alloy is one of the representative materials oflead frame.C194铜合金是最具代表性的引线框架材料之一。
Die Bonder is key equipment which binds semiconductor microchip ontoLeadFrame in semiconductor back-end production.全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
At the same time production of IClead frame, fluorescent display, VFD display, grid and plastic processing business.同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
Thelead framewith the opening in die pad can significantly improve the package warpage and die stresses.导线架晶片座开槽型式，对构装翘曲及晶片应力也有明显改善效果。
Die Bonder is manufacturing equipment which binds IC chip ontoLeadFrame in semiconductor production.粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。 |