| 释义 |
Leadframe
基本例句
引线框架¹⁰⁰
This small footprint package is lead free, with 100% matte tinleadframeplating.该小型封装为无铅产品,且引脚框采用100%雾锡电镀。
Theleadframeis plated with 100% matte tin, which is compatible with standard lead free printed circuit board assembly processes.引脚架采用100%雾锡电镀,可与标准无铅印刷电路板装配流程兼容。
Effects of thermo-mechanical treatment on microstructure and properties of C194 copper alloyleadframematerials were investigated.研究了形变热处理对C194铜合金引线框架材料组织和性能的影响。
This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copperleadframedie paddle during assembly process.中文摘要本论文主要针对铜钉架在经过封装制程其本身与胶饼间所产生的脱层现象做研究。 |