| 释义 |
en·cap·su·lant 英enˈkæpsələnt美ɛnˈkæpsələntAHDĕn-kăpʹsə-lənt COCA³¹⁵¹¹¹⁺⁴
基本例句
n.密封剂¹⁰⁰
The mechanical properties of two-component polyurethane encapsulant for electric equipment which manufactured by hydroxyl- terminal polybutadiene and isocyanate by one step are studied.
以端羟基聚丁二烯、异氰酸酯为原料，采用一步法合成了聚氨酯电器灌封胶。 chemyq
The powdered NBR and ultrafine calcium carbonate filled powdered NBR were prepared with coacervationcoprecipitation method by using polymeric resin as encapsulant.
以高分子树脂膜为包覆剂，采用凝聚共沉法制备非填充型粉末 NBR和超细碳酸钙填充粉末 NBR。 cnki
The thermal and mechanical properties of the modified epoxy encapsulant were introduced.
并对改性后封装料的结构、热性能和机械性能作了详细介绍。 iciba
It is mainly used in microelectronic Industry. Widely used for the encapsulant of semiconductors and integrated circuits.
主要用于微电子行业，被广泛应用于半导体器件、集成电路等分装材料。 jiayunshihua
Used as a general purpose encapsulant that has excellent adhesion to a wide variety of substrates.
作为一个通用密封材料具有优异的粘接性能的各种感光。 sm160
This curable materials could be used in organic encapsulant.
此材料可以做为有机封装材。 iciba |