| 释义 |
electronic packaging短语¹⁴⁴⁹⁷²⁺²
基本例句
电子封装,电子组装,电子电路组装
Flip- chip bonding technology is a potential process in the electronic packaging.
凸点芯片倒装焊接是一种具有发展潜力的芯片互连工艺技术。 cnki
With the feature of the electronic/span> packaging in different steps, the development of the electronic packaging CAD were discussed and the trend was chiefly analyzed in this paper.
本文结合各个时期电子封装的特点，介绍了封装 CAD技术的发展历程，并简要分析了今后发展趋势。 cnki
With the development of microelectronics and semiconductor, the density of electronic packaging increases quickly, which result in the high demand to the material.
随着微电子技术及半导体技术的发展，高的封装密度对材料提出了更高的要求。 cnki
With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability.
由于封装材料与封装工艺的改变，给焊点可靠性带来了一系列相关问题。 dictall
Electronic speckle pattern interferometryESPI and finite element method FEM calculation have been used to investigate the thermal failure behaviors of the metal substrate in electronic packaging.
本文将电子散斑干涉与有限元数值计算相结合，对金属基板结构的热失效行为进行了研究。 cnki |