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词汇
directly wafer bonding
释义
directly wafer bonding
基本
例句
晶片直接键合
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。
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obsessive -compulsive disorder
obsessive-compulsive disorderocd
obsessive-compulsive disorder ocd
Obsessive-compulsive disorders
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Obsessive-Compulsive Neuroses
obsessive compulsive neurosis
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obsessive-compulsive personalistics
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Obsessive-Compulsive Personalities
obsessive compulsive personality
obsessive-compulsive personality
Obsessive compulsive personality disorder
obsessive-compulsive personality disorder
obsessive-compulsive personality disorderocpd
Obsessive compulsive personality trait
obsessive-compulsive personality trait
obsessive compulsive reaction
obsessive-compulsive reaction
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obsessive-compulsive spectrum disorder
Obsessive compulsive spectrum disorders
obsessive-compulsive state
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更新时间:2025/4/11 7:59:30