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词汇
Die attach or chip bonding
释义
Die attach or chip bonding
基本
例句
芯片贴装
Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
随便看
Ganoderma ucidum
Ganoderma ungulatum
Ganoderma valesiacum
ganoderma weberianum
Ganoderma wuhuense
Ganoderma xingyiense
Ganoderma zhenningense
ganoderma〖中文名〗灵芝
ganoderme
Ganoderm Lucidum
Ganodernalucidum
ganoderol
ganoderol A
ganoderol B
ganoderpurine
Ganoderrna
Ganoderrna lucidum
Ganoderrna Lucidum polysaccharide
Ganoderrna lucidurn
Ganoderrna tenus
ganodorma lucidum spores
Ganoe
ganof
ganofs
Ganofsky
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更新时间:2025/3/31 9:10:35