| 释义 |
Die attach
基本例句
固晶
As for high power device, paste/SSDA is used popular fordie attach.对那些做大功率器件的客户来说，锡膏或者焊线用来贴芯片比较普遍。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior todie attach, wire bond and encapsulation.等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
An integrated circuit, for example, may consist of a silicon die,die attachmaterial, epoxy underfill, mould compound, leads, and lead plating materials.例如一个集成电路芯片的组成由硅基模，模固定材料，环氧树脂填充物质，模压成分，导线，导线镀层材料。
This product design for IC assembly die attache process on die bonder machine.本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
Wafer Backside Coating of Die Attach Adhesives固晶粘合剂在晶圆背面的涂覆 |