| 释义 |
copper clad短语¹¹⁴⁴⁶⁷⁺⁴
基本例句
adj.包铜的
A preliminary application of the polyimide film to two layer flexible copper clad lamination was studied.
对该聚酰亚胺在二层柔性覆铜板上的应用进行了初步研究。 cj380.com
The methods that PCB manufacturers should use are as follows: selection of copper clad laminates, process control, selection of surface finish, analysis of quality problems.
PCB厂家主要从以下几个方面加于控制解决：板材的选择、制程控制、表面工艺选用、过程质量存在问题分析。 cnki
The nitrogen-containing phenolic resin was used as curing agent in phosphorous epoxy, and a halogen-free copper clad laminate with comprehensive performance successfully was developed.
采用含氮酚醛固化含磷环氧，成功开发出综合性能优良的无卤覆铜板。 dictall
The copper clad laminate is made of the modified resin system and aromatic polyamide nonwoven cloth.
以此树脂为基体，以芳酰胺无纺布为增强材料制作覆铜板； cnki
Cyanate compound, the preparation of triazine copper clad panel and 1ts application in high frequency printed circuit board were introduced in this paper.
本文介绍了氰酸酯化合物，三嗪覆铜板的制备及其在高频线路板上的应用。 chemyq
I'm looking for a small quantity only2 at the moment of insulated copper clad aluminum wire for an electromagnet project.
我在为一个电磁项目寻找小量目前只有2根绝缘铜铝电线。 cnexp
The copper clad laminate automation system is designed and realized by using Program Logic Controler PLC.
简要阐述了用可编程控制器 PLC实现对铜箔覆胶机自动控制的方法。 dictall
Copper clad laminate, other backed, of a thickness not exceeding 0.07 mm.
铜箔基板，其它衬者，其厚度在0．07公厘及以下者。 tdcinfo.sme.net.cn
Copper clad laminate, polyimide backed, of a thickness not exceeding 0.07 mm.
铜箔基板，以聚醯亚氨为衬，其厚度在0．07公厘及以下者。 tdcinfo.sme.net.cn
Copper clad laminate, paper- phenolic backed, of a thickness not exceeding 0.07 mm.
铜箔基板，以酚树脂为衬，其厚度在0．07公厘及以下者。 tdcinfo.sme.net.cn |