| 释义 |
CBGA
基本例句
陶瓷球栅阵列¹⁰⁰
Effect of Solder Paste Volume on Reliability ofCBGAAssemblies焊膏厚度对CBGA组装板可靠性的影响
Construction of a Three-dimensional FEA Model ofCBGAand Simulation of the Three-dimensional Stress and Strain of Weld陶瓷球栅阵列封装的有限元模拟与焊点应力分析
CBGACeramic Ball Grid Array陶瓷焊球阵列
CBGApackageCBGA封装
ceramic ball grid array陶瓷球栅阵列封装 |